According to South Korea’s ET News, Apple’s AR/VR headset is once again rumored to feature an advanced Micro-OLED display.
Micro-OLED displays are built directly on a chip wafer, rather than a glass substrate, and can be thinner, smaller, and more energy-efficient, with pixel sizes in the 4 to 20-micron range, compared to the 40 to 20-micron pixel size of standard OLED panels. 300 microns. Micro-OLED displays have faster response times and are more suitable for augmented reality (AR) and virtual reality (VR) applications.
A report from The Elec last year claimed that Apple’s headsets could feature high-resolution Micro-OLED displays with up to 3,000 pixels per inch. Apple analyst Ming-Chi Kuo also said that Micro-OLED displays will facilitate AR/VR experiences with headsets.
A report from The Elec last year claimed that Apple’s headsets could feature high-resolution Micro-OLED displays with up to 3,000 pixels per inch. Apple analyst Ming-Chi Kuo also said that Micro-OLED displays will facilitate AR/VR experiences with headsets.
ET News says Apple’s Micro-OLED displays will be supplied by TSMC, which has partnered with TSMC to develop “super-advanced” Micro-OLED displays for “upcoming AR devices” at a secret facility in Taiwan. On the other hand, other reports from Japan and display analyst Ross Young have been claiming that Apple will use Sony’s Micro-OLED displays. The reporter learned that ET News also reiterated the recent news that the headset has completed engineering verification testing and will be equipped with M1 series chips.
In addition, ET News claims that Samsung is planning to launch an AR device with “holographic” technology and an Exynos chip. It was previously reported that Samsung is significantly behind in AR and VR devices, in part due to its “obsession” with foldable devices. According to sources, Samsung is working with Microsoft and DigiLens to develop its AR device, which has entered the prototyping stage.
Source: C114 Communication Network
Author： Miao Wang
